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Research
Material specification
材料規(guī)格書

Aluminium nitride / AlN

Material Description: High thermal conductivity (>170W/(m-°C)), high corrosion resistance, high temperature resistance, low coefficient of expansion (4~5 μm/(m·°C)) and low density (>3.30g/cm3) characteristics of ceramic materials. Main applications: heat dissipation components, chip package substrates, etc.


Composition:

Y2O3

AlN

4±1

Bal.


Physical properties:

Properties

Unit

氮化鋁AlN

Density ρ

g/cm3

>3.30

Bending strength

MPa

300

Thermal conductivity

W/(m*K)

200

Coefficient of thermal expansion(CTE)

25~200

μm/(m·℃)

4.8


Micrograph (×1500)

  

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