Kovar alloy
Material Description: The material has a coefficient of expansion close to that of glass materials (coefficient of expansion: 5~6 μm/(m·°C)), which makes it suitable for application scenarios such as sealing and mounting with glass, and chip mounting.
Element composition:
C |
Ni |
Co |
Cr |
Mn |
Si |
Mo |
Fe |
≤0.03 |
29±0.5 |
17.3±0.5 |
≤0.2 |
≤0.5 |
≤0.3 |
≤0.2 |
Bal. |
Physical properties:
Properties |
Unit |
可伐合金(Kovar) |
Density ρ |
g/cm3 |
>7.8 |
Hardness |
Hv |
160 |
Tensile strength Rm |
MPa |
400 |
Yield strength Rp0.2 |
MPa |
200 |
Elongation A10 |
% |
10 |
Thermal conductivity |
W/(m·℃) |
21.4 |
Coefficient of thermal expansion |
20~200℃ μm/(m·℃) |
5.6 |
Metallography (×200)