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Research
Material specification
材料規(guī)格書

Tungsten-copper alloy

Material Introduction: High strength, high thermal conductivity and low thermal expansion coefficient tungsten-copper alloy is produced by MIM process. This material is a pseudo alloy material compounded by tungsten and copper two-phase metals, which is applied to 5G communication connectors, electrical contact materials, heat dissipation materials, chip packaging materials, etc. with high thermal conductivity and low coefficient of thermal expansion requirements.


Element composition:

Model

Cu

W

雜質(zhì)總和

W80Cu20

20±2

80±2

0.5

W70Cu30

30±2

70±2

0.5


Physical properties:

Properties

Unit

W80Cu20

W70Cu30

Density ρ

g/cm3

>14.9

>13.6

Hardness

Hv

260

175

Tensile strength Rm

MPa

700

560

Yield strength Rp0.2

MPa

600

410

Elongation A10

%

0.5

1

Thermal conductivity

W/(m·℃)

172

200

Coefficient of thermal expansion

25~200

μm/(m·℃)

8.3

9.9


Metallography (×500)

  

:W80Cu20;右:W70Cu30

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